Cryostat Microtome NQ3600 ee codsiga histopathology
Astaamaha
- 1. Shaashadda taabashada LCD ee midabka 10-inji ah waxay soo bandhigi kartaa wadarta tirada iyo dhumucda jeexjeexyada, dhumucdiisuna tahay hal jeex, muunadda soo noqoshada istaroogga, xakamaynta heerkulka, iyo sidoo kale hawlaha sida taariikhda, wakhtiga, heerkulka, hurdo waqtiyeysan oo shidan, buug-gacmeed iyo si toos ah u dhalaalid
- 2. Shaqada hurdo ee bani'aadamnimada: xulashada qaabka hurdada, heerkulka qaboojiyaha si toos ah ayaa loo xakameyn karaa inta u dhaxaysa -5 ~ -15 ℃. Deminta habka hurdada, heerkulka goynta waxaa lagu gaari karaa 15 daqiiqo gudahood ·
- 3. Marka xajintu muunadu u guurto meesha xadka, waxay si toos ah ugu soo noqon doontaa booska bilawga ah.
- 4. Dareemaha heerkulka shaqada is-hubinta ayaa si toos ah u ogaan kara heerka shaqada ee dareemayaasha.
- 5. SECOP laba kombaresarada waxay siisaa qaboojiyaha qaboojiyaha, marxaladda qaboojinta, mindida haysta iyo xajinta muunada, iyo fidiyaha nudaha.
- 6. Qalab-haystaha mindida wuxuu ku qalabaysan yahay daab buluug ah iyo ul difaac ah oo daboolaya dhammaan dhererka daabka, si loo ilaaliyo isticmaalayaasha.
- 7. Saxarada unugyada midabada badan leh waxay fududeeyaan in la kala saaro unugyo kala duwan.
- 8. Lagu qalabeeyay rafaadka qalabka caagga ah iyo sanduuqa qashinka.
- 9. dhidibka X 360 °/ Y- dhidibka 12 ° caalami ah isku dhufashada xajin, fududeeyo rakibaadda muunad.
- 10. Ku darista qaboojiyaha falaashiyaha unugyada ka hortagga-ku-dhejinta, heerkulku wuxuu gaari karaa -50 ° C, taasoo ka dhigaysa mid ku habboon in si degdeg ah loo qaboojiyo unugyada iyo badbaadinta wakhtiga hawlgalka.

11. Hal lakab oo quraarad ah oo kululaynta ayaa si wax ku ool ah u ilaalinaysa uumi biyaha.

12. Shaadhka gacantu waxa uu taagan yahay 360 ° waxaana la xidhi karaa meel kasta.
Tilmaamaha
Kala duwanaanta heerkulka qaboojiyaha | 0℃ ~ -50℃ |
Heerkulka heerka qaboojinta | 0℃ ~ -55℃ |
Xakamaynta heerkulka kala duwan ee muunada xajin | 0℃ ~ -50℃ |
Heerkulka Heerkulka qaboojinta oo dheeraad ah | -60℃ |
Goobaha qaboojinta ee Marxaladda Qaboojinta Baraf-la'aanta | ≥27 |
Meelaha qaboojiyaha Semiconductor ee Marxaladda Qaboojinta | ≥6 |
Waqtiga shaqada ee semiconductor qaboojin degdeg ah | 15 daqiiqo |
Cabbirka qaybta ugu badan ee muunada | 55*80 mm |
Dhaqdhaqaaq toosan oo muunad ah | 65 mm |
Faalig dhaqdhaqaaq toosan oo muunad ah | 22 mm |
Xawaaraha jarista korontada | 0.9 mm/s, 0.45 mm/s |
Habka jeermiska jeermiska | shucaaca ultraviolet |
dhumucda qaybta | 0.5 μm ~ 100 μm, la hagaajin karo |
0.5 μm ~ 5 μm, oo leh qiimaha delta ee 0.5 μm | |
5 μm ~ 20 μm, oo leh qiimaha delta ee 1 μm | |
20 μm ~ 50 μm, oo leh qiimaha delta ee 2 μm | |
50 μm ~ 100 μm, oo leh qiimaha delta ee 5 um | |
Dhumucda gooynta | 0 μm ~ 600 μm la hagaajin karo |
0 μm ~ 50 μm, oo leh qiimaha delta ee 5 μm | |
50 μm ~ 100 μm, oo leh qiimaha delta ee 10 μm | |
100 μm ~ 600 μm, oo qiimaheedu yahay 50 μm | |
Muunada soo noqoshada istaroogga | 0 μm ~ 60 μm, lagu hagaajin karo oo leh qiimaha delta ee 2 μm |
Cabbirka alaabta | 700*760*1160 mm |